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手机用电源管理LSI_BD7185AGWL
BD7185AGWL是使用小型晶圆级CSP封装(80针0.4mm-pitch 3.8mm-by- 3.8mm)的综合电源管理LSI。最适合智能电话等空间有限的设备。
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* 本产品是标准级的产品。本产品不建议使用的车载设备。 |
特性:
ch | 5 |
Vin1(Min.)[V] | 2.6 |
Vin1(Max.)[V] | 5.5 |
Serial I/F | I2C |
Operating Temperature (Min.)[°C] | -35 |
Operating Temperature (Max.)[°C] | 85 |
特点:
- · 5-channel high-efficiency Buck Converters
(16-step adjustable VO by I²C)
· 12-channel CMOS-type LDO
(16-step adjustable VO by I²C)
· LDO and Buck Converter power ON/OFF control by
I²C interface or external pin.
· Power ON/OFF sequence.
· 32.768kHz OSC and output buffer.
· 4-to-1 analog switch.
· TCXO buffer.
· SIM card I/F
· I²C compatible Interface.
· I²C device address changeable by ADRS pin.
(Device address is “1001011”,”1001100”)
· Small and thin CSP package
(3.8mm × 3.8mm height 0.57mm max)
引脚配置图:
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技术信息
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs