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Microwire BUS 1Kbit(64x16bit) EEPROM_BR93G46FV-3B

BR93G46-3B是串行3线式接口方式的串行EEPROM。
数据bit格式为固定的16bit，采用3PIN定为CS PIN的PIN配置。

基础信息
（环境数据等）  
FAQ 
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型号
Status
封装
包装数量
最小独立包装数量
包装形态
RoHS
BR93G46FV-3BGTE2 供应中 SSOP-B8 2500 2500 Taping Yes
 
特性：
Grade Standard
I/F MicroWire BUS(3-Wire)
Density [bit] 1K
Bit Format [Word x Bit] 64 x 16
Package SSOP-B8
Operating Temperature (Min.)[°C] -40
Operating Temperature (Max.)[°C] 85
Vcc(Min.)[V] 1.7
Vcc(Max.)[V] 5.5
Circuit Current (Max.)[mA] 3.0
Standby Current (Max.)[μA] 2.0
Write Cycle (Max.)[ms] 5.0
Input Frequency (Max.)[Hz] 3M
Endurance (Max.)[Cycle] 106
Data Retention (Max.)[Year] 40
Comment Pin rotated type. Cu wire bonding.
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特点：
  • ・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
    ・ Operations available at high speed 3MHz clock (4.5V ~ 5.5V)
    ・ High speed write available (write time 5ms max.）
    ・ Same package and pin configuration from 1Kbit to 16Kbit
    ・ 1.7~5.5V single power source operation
    ・ Address auto increment function at read operation
    ・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
    ・ Self-timed programming cycle
    ・ Program condition display by READY / BUSY
    ・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
    ・ More than 40 years data retention
    ・ More than 1 million write cycles
    ・ Initial delivery state all addresses FFFFh
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相关产品
相关新产品/产品更新存储器
PART NUMBER Product Name Package Datasheet Distribution Inventory
BR93G46-3B Microwire BUS 1Kbit(64x16bit) EEPROM DIP-T8   购买
BR93G46F-3B Microwire BUS 1Kbit(64x16bit) EEPROM SOP8   购买
BR93G46FJ-3B Microwire BUS 1Kbit(64x16bit) EEPROM SOP-J8   购买
BR93G46FVJ-3B Microwire BUS 1Kbit(64x16bit) EEPROM TSSOP-B8J   购买
BR93G46FVM-3B Microwire BUS 1Kbit(64x16bit) EEPROM MSOP8   购买
BR93G46FVT-3B Microwire BUS 1Kbit(64x16bit) EEPROM TSSOP-B8   购买
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技术信息
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.

Part Explanation

For ICs