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Microwire BUS 1Kbit(64x16bit) EEPROM_BR93G46FV-3B BR93G46-3B是串行3线式接口方式的串行EEPROM。
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* 本产品是标准级的产品。本产品不建议使用的车载设备。 |
特性:
Grade | Standard |
I/F | MicroWire BUS(3-Wire) |
Density [bit] | 1K |
Bit Format [Word x Bit] | 64 x 16 |
Package | SSOP-B8 |
Operating Temperature (Min.)[°C] | -40 |
Operating Temperature (Max.)[°C] | 85 |
Vcc(Min.)[V] | 1.7 |
Vcc(Max.)[V] | 5.5 |
Circuit Current (Max.)[mA] | 3.0 |
Standby Current (Max.)[μA] | 2.0 |
Write Cycle (Max.)[ms] | 5.0 |
Input Frequency (Max.)[Hz] | 3M |
Endurance (Max.)[Cycle] | 106 |
Data Retention (Max.)[Year] | 40 |
Comment | Pin rotated type. Cu wire bonding. |
特点:
- ・ 3-line communications of chip select, serial clock, serial data input / output (the case where input and output are shared)
・ Operations available at high speed 3MHz clock (4.5V ~ 5.5V)
・ High speed write available (write time 5ms max.)
・ Same package and pin configuration from 1Kbit to 16Kbit
・ 1.7~5.5V single power source operation
・ Address auto increment function at read operation
・ Write mistake prevention function » Write prohibition at power on » Write prohibition by command code » Write mistake prevention function at low voltage
・ Self-timed programming cycle
・ Program condition display by READY / BUSY
・ Compact package SOP8/SOP-J8/SSOP-B8/TSSOP-B8/MSOP8/ TSSOP-B8J/DIP-T8/VSON008X2030
・ More than 40 years data retention
・ More than 1 million write cycles
・ Initial delivery state all addresses FFFFh
应用:
相关产品
相关新产品/产品更新存储器
PART NUMBER | Product Name | Package | Datasheet | Distribution Inventory |
---|---|---|---|---|
BR93G46-3B | Microwire BUS 1Kbit(64x16bit) EEPROM | DIP-T8 | 购买 | |
BR93G46F-3B | Microwire BUS 1Kbit(64x16bit) EEPROM | SOP8 | 购买 | |
BR93G46FJ-3B | Microwire BUS 1Kbit(64x16bit) EEPROM | SOP-J8 | 购买 | |
BR93G46FVJ-3B | Microwire BUS 1Kbit(64x16bit) EEPROM | TSSOP-B8J | 购买 | |
BR93G46FVM-3B | Microwire BUS 1Kbit(64x16bit) EEPROM | MSOP8 | 购买 | |
BR93G46FVT-3B | Microwire BUS 1Kbit(64x16bit) EEPROM | TSSOP-B8 | 购买 |
New Products:
技术信息
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs