手机用MSDL(Mobile Shrink Data Link)收发器_BU7964GUW

BU7964GUW是连接手机LCD模块和主机CPU的差分串行接口LSI。通过罗姆独创的MSDL技术，实现低功耗和低EMI化。
能够以较少的接线根数连接手机的复杂铰链部位。通过改善接线的耐弯曲性等及减少连接器弯曲数，有助于提高可靠性。

Data Sheet

咨询

基础信息
（环境数据等）

FAQ

购买 *

* 本产品是标准级的产品。本产品不建议使用的车载设备。

型号	Status	封装	包装数量	最小独立包装数量	包装形态	RoHS
BU7964GUW-E2	供应中	VBGA063W050	2500	2500	Taping	Yes

特性：

VDD Core(Min.)[V]	1.65
VDD Core(Max.)[V]	1.95
VDD I/O(Min.)[V]	1.65
VDD I/O(Max.)[V]	1.95
Function	Rx
Interface	RGB24bit, Hsync, Vsync, DE, PCLK
Data Rates [Mbps]	1350
Channel	Data×3, Clock×1
Operating Temperature (Min.)[°C]	-30
Operating Temperature (Max.)[°C]	85

特点：

・ MSDL3 high-speed differential interface with a maximum transfer rate of 1350 Mbps.
・ Compatible with24-bit RGB video mode for LCD controller-to-LCD interface.
・ Pixel clock frequency range from 4 to 45MHz.
・ Depending on the data transfer rate, either, two or three differential data channels can be selected.

应用：

相关新产品/产品更新接口

PART NUMBER	Product Name	Package	Distribution Inventory
BU7961GUW	手机用MSDL(Mobile Shrink Data Link)收发器	VBGA063W050	购买
BU7962GUW	手机用MSDL(Mobile Shrink Data Link)收发器	VBGA063W050	购买
BU7963GUW	手机用MSDL(Mobile Shrink Data Link)收发器	VBGA063W050	购买

New Products:

New Product List

技术信息

Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.

Part Explanation

For ICs