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手机用MSDL(Mobile Shrink Data Link)收发器_BU7964GUW BU7964GUW是连接手机LCD模块和主机CPU的差分串行接口LSI。通过罗姆独创的MSDL技术,实现低功耗和低EMI化。
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* 本产品是标准级的产品。本产品不建议使用的车载设备。 |
型号 | Status | 封装 | 包装数量 | 最小独立包装数量 | 包装形态 | RoHS |
---|---|---|---|---|---|---|
BU7964GUW-E2 | 供应中 | VBGA063W050 | 2500 | 2500 | Taping | Yes |
特性:
VDD Core(Min.)[V] | 1.65 |
VDD Core(Max.)[V] | 1.95 |
VDD I/O(Min.)[V] | 1.65 |
VDD I/O(Max.)[V] | 1.95 |
Function | Rx |
Interface | RGB24bit, Hsync, Vsync, DE, PCLK |
Data Rates [Mbps] | 1350 |
Channel | Data×3, Clock×1 |
Operating Temperature (Min.)[°C] | -30 |
Operating Temperature (Max.)[°C] | 85 |
特点:
- ・ MSDL3 high-speed differential interface with a maximum transfer rate of 1350 Mbps.
・ Compatible with24-bit RGB video mode for LCD controller-to-LCD interface.
・ Pixel clock frequency range from 4 to 45MHz.
・ Depending on the data transfer rate, either, two or three differential data channels can be selected.
技术信息
Thermal Resistance
The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.
Part Explanation
For ICs