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手机用MSDL(Mobile Shrink Data Link)收发器_BU7964GUW

BU7964GUW是连接手机LCD模块和主机CPU的差分串行接口LSI。通过罗姆独创的MSDL技术,实现低功耗和低EMI化。
能够以较少的接线根数连接手机的复杂铰链部位。通过改善接线的耐弯曲性等及减少连接器弯曲数,有助于提高可靠性。

* 本产品是标准级的产品。本产品不建议使用的车载设备。
型号
Status
封装
包装数量
最小独立包装数量
包装形态
RoHS
BU7964GUW-E2 供应中 VBGA063W050 2500 2500 Taping Yes
 
特性:
VDD Core(Min.)[V] 1.65
VDD Core(Max.)[V] 1.95
VDD I/O(Min.)[V] 1.65
VDD I/O(Max.)[V] 1.95
Function Rx
Interface RGB24bit, Hsync, Vsync, DE, PCLK
Data Rates [Mbps] 1350
Channel Data×3, Clock×1
Operating Temperature (Min.)[°C] -30
Operating Temperature (Max.)[°C] 85
特点:
  • ・ MSDL3 high-speed differential interface with a maximum transfer rate of 1350 Mbps.
    ・ Compatible with24-bit RGB video mode for LCD controller-to-LCD interface.
    ・ Pixel clock frequency range from 4 to 45MHz.
    ・ Depending on the data transfer rate, either, two or three differential data channels can be selected.
 
 
 
 
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BU7961GUW 手机用MSDL(Mobile Shrink Data Link)收发器 VBGA063W050   购买
BU7962GUW 手机用MSDL(Mobile Shrink Data Link)收发器 VBGA063W050   购买
BU7963GUW 手机用MSDL(Mobile Shrink Data Link)收发器 VBGA063W050   购买
New Products:
 
 
技术信息
Thermal Resistance

The definition and how to use thermal resistance and thermal characterization parameter of packages for ROHM’s integrated circuit are described in this application note.