SMLP13WBC9W
PICOLED™（霹克镭）系列

罗姆的PICOLED®(霹克镭)－发挥其超小型、超薄型规格的优点，可以创建颠覆传统的超精细矩阵。将表现电位提高到极限。另外，是今后实现整机小型化、薄型化时不可或缺的主力产品。

Data Sheet 购买
Data Sheet 购买
  • 文档  
  • 设计模型  
  • 封装和质量数据  
  • FAQ
  • 联系我们

主要规格

 
型号 | SMLP13WBC9W1
Status | 可购买
封装 | SMLP1xW
包装数量 | 5000
最小独立包装数量 | 5000
包装形态 | Taping
RoHS | Yes

特性：

Package Type

Mini-mold

LED Type

Standard

Package size[mm]

1.0x0.6 (t=0.2)

Emitting color

White

Luminous Intensity(Single)(Typ.)[mcd]

150.0

Number of Brightness Rank

4

Chromaticity coordinates(x,y)

(0.29, 0.29)

Forward Voltage VF (Typ.) [V]

2.9

IF @ VF [mA]

5

Chip Structure

InGaN

Power Dissipation [mW]

33

Operating Temperature[°C]

-40 to 85

Storage Temperature [°C]

-40 to 100

特点：

・PICOLED™(霹克雷)系列
・1.0x0.6(t=0.2)的超小型、超薄型封装
SHOW/HIDE COLUMNS
New Product List

设计资源

 

文档

White Paper

  • ROHM Automotive Lighting Solutions

技术记事

Schematic Design & Verification

  • About LED Devices
  • How to read LED characteristics data
  • About LED Package
  • About LED Parallel Circuits
  • Relationship between Recommended LED Soldering Pattern and Solder Amount
  • Electrostatic Breakdown of LEDs
  • Chromaticity Classification of LEDs in RGB Color Mixing
  • Degradation of luminous intensity of blue and white products due to long-term use of LEDs
  • Relationship between LED Chip Position and Directivity
  • About LED Optical Unit
  • The relationship between LED luminous intensity and luminous flux
  • LED Manual

Thermal Design

  • Thermal Resistance of LEDs

设计模型

Models

  • SMLP13WBC9W SPICE Model
  • SMLP13WBC9W Ray Data

2D/3D/CAD

  • SMLP13WBC9W 3D STEP Data
  • Parasolid X_T File
  • 3D eDrawings Data

封装和质量数据

Manufacturing Data

  • Factory Information

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • Compliance of the ELV directive
  • MSDS
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations