核心技术
电力电子
Technology that contributes to guaranteeing stable operation of instruments Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives
Research areas
- Semiconductor packaging
- Design for reliability
Presented papers
- Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives
- Elucidation of Adhesive Interaction between the Epoxy Molding Compound and Cu Lead Frames
Introductory Video
Comparative study of the ideal and actual adhesion interfaces of the die bonding structure using conductive adhesives
The technology that contributes to cost reduction of power amplifiers Deep-donor-induced suppression of current collapse in an AlGaN-GaN heterojunction structure grown on Si
Research areas
- Power Electronics
Presented papers
Introductory Video
Deep-donor-induced suppression of current collapse in an AlGaN-GaN heterojunction structure grown on Si
Technology that contributes to energy saving by improvement of performance A Method for Measuring the Characteristics of Power Transistors in the Real Operating Range
Research areas
- Power transistor
- Device characterization
- Device modeling
Presented papers
- High-Voltage and High-Current Id–Vds Measurement Method for Power Transistors Improved by Reducing Self-Heating
- Electrothermal Cosimulation for Predicting the Power Loss and Temperature of SiC MOSFET Dies Assembled in a Power Module
- Magnetic Near-field Strength Prediction of a Power Module by Measurement-Independent Modeling of its Structure
Introductory Video
A Method for Measuring the Characteristics of Power Transistors in the Real Operating Range
Technology that contributes to noise suppression in the
development of power electronics circuits Magnetic
Near-field Strength Prediction of a Power Module
by Measurement-Independent
Modeling of its Structure
Research areas
- Electromagnetic simulation
- Power Modules
Presented papers
Introductory Video
Magnetic Near-field Strength Prediction of a Power Module by Measurement-Independent Modeling of its Structure
Simulation Environment Development for Power Devices and ModulesAccurate Prediction of How Power System Works
Research areas
- Device Modeling, Circuit Simulation, Double Pulse Test, Power Module
- Electro-thermal Co-simulation
Device Modeling and Power Module Modeling
Electro-thermal Co-simulation
Presented papers
“Ultra Small*, Cool Well”Transfer Molded SiC Power Module
*August, 2018 ROHM survey
Features
- The industry’s lowest*1 thermal resistance*2
- Ultra-compact, lightweight
- High power density : 15kW/cm3
*1 : August, 2018 ROHM survey
*2 : With the same chip size, board size, and
cooling capacity
Applications
- Automotive high-power DC/DC converters
- Main drive inverters in vehicles
Appearance
Thermal Resistance (Rthj-w)
Max. Junction Temperature Comparison
SiC Modules Contribute to Wireless Power Supply for In-Wheel Motors While DrivingEnabling Direct Wireless Charging While Driving Significantly Extends EV Travel Range (to Nearly Infinity in Theory)
Joint development with the Fujimoto Laboratory at Tokyo University and several other companies
SiC Application Demonstration3-Phase 50kW Bidirectional Inverter Utilizing SiC Devices
Features
- Demonstration of a 3-phase bidirectional inverter that delivers over 99% (Max) efficiency
- Achieves 50kW output utilizing discrete devices
- Achieves 1.8x the output power of the previous 30kW inverter demo
Applications
- Grid-connected energy storage systems
- Uninterruptible power systems
- Power circulating load equipment
Overview
SiC Devices
Circuit Configuration
Characteristics
Performance
2MHz/120W DC/DC Converter Using GaN-FET2MHz/120W DC/DC Converter
Features
- Small size
- Large power density
Applications
- Base station power systems
- Server power systems
Circuit Configuration
Specification
Power Conversion Efficiency Comparison
Power Density
Reliability Design For Electronic PackagesDeformation Behavior Analysis of Electronic Materials and Packages
Research areas
- Mate rials : Sintered silver, Solder, Resin
- Materials characterization : Film Tensile test, Stress-Strain curve, Thermal deformation, Finite Element Method
Research Example1 : Mechanical Behaviors of Sintered Porous Silver films
Research Example2 : For Designing Reliable Packages
