Models
- R6024ENZ SPICE Model
- R6024ENZ Thermal Model (lib)
Characteristics Data
- ESD Data
R6024ENZ
R6024ENZ
低噪声规格 Nch 600V 24A 功率MOSFET
R6xxxENx系列是重视易用性，以低噪声性能为特点的Super Junction MOSFET产品。该系列产品可在音响和照明等需要尽可能抑制噪声的应用中实现高性能。
主要规格
特性：
Grade
Standard
Package Code
TO-3PF
Package Size[mm]
26.5x15.5 (t=5.5)
Applications
Power Supply
Number of terminal
3
Polarity
Nch
Drain-Source Voltage VDSS[V]
600
Drain Current ID[A]
24.0
RDS(on)[Ω] VGS=10V(Typ.)
0.15
RDS(on)[Ω] VGS=Drive (Typ.)
0.15
Total gate charge Qg[nC]
70.0
Power Dissipation (PD)[W]
120.0
Drive Voltage[V]
10.0
Trr (Typ.)[ns]
625
Mounting Style
Leaded type
Bare Die Part Number
Available: K7402
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
特点：
- Low on-resistance
- Fast switching speed
- Gate-source voltage (VGSS) guaranteed to be ±20V
- Drive circuits can be simple
- Parallel use is easy
- Pb-free lead plating ; RoHS compliant
设计资源
技术记事
Schematic Design & Verification
- Temperature derating method for Safe Operating Area (SOA)
- 开关电路的功率损失计算
- 开关波形的监测方法
- 功率测量中探针校正的重要性 倾斜校正篇
- 旁路电容器的阻抗特性
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- 热仿真用双热阻模型
- What is a Thermal Model? (Transistor)
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- 热阻RthJC 的测量方法和使用方法
- 使用热电偶测量封装背面温度时的注意点
设计模型
Models
- R6024ENZ SPICE Model
- R6024ENZ Thermal Model (lib)
Characteristics Data
- ESD Data
封装和质量数据
Package Information
- Package Dimensions
- Inner Structure
- Moisture Sensitivity Level
- Anti-Whisker formation
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations