Models
- RB078BGE30S SPICE Model
Characteristics Data
- RB078BGE30S ESD Data
RB078BGE30S
主要规格
特性：
Grade
Standard
Configuration
Single
Package Code
TO-252 (DPAK)
Package(JEITA)
SC-63
Package Size[mm]
6.6x10.0 (t=2.2)
Mounting Style
Surface mount
Number of terminal
3
VRM[V]
35
Reverse Voltage VR[V]
30
Average Rectified Forward Current IO[A]
5.0
IFSM[A]
50.0
Forward Voltage VF(Max.)[V]
0.72
IF @ Forward Voltage [A]
5.0
Reverse Current IR(Max.)[mA]
0.005
VR @ Reverse Current[V]
30
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
特点：
- High reliability
- Power mold type
- Super Low IR
设计资源
技术记事
Schematic Design & Verification
- 开关波形的监测方法
- 功率测量中探针校正的重要性 倾斜校正篇
- 旁路电容器的阻抗特性
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- 热仿真用双热阻模型
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- 热阻RthJC 的测量方法和使用方法
- 使用热电偶测量封装背面温度时的注意点
设计模型
Models
- RB078BGE30S SPICE Model
Characteristics Data
- RB078BGE30S ESD Data
封装和质量数据
Package Information
- Taping Information
- Anti-Whisker formation
Environmental Data
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations