Models
- RB088NS150FH SPICE Model
- RB088NS150FH Thermal Model (lib)
Characteristics Data
- ESD Data
RB088NS150FH
RB088NS150FH
150V, 10A, Schottky Barrier Diodes (支持 AEC-Q101)
车载肖特基二极管
与通用品共用数据表。下订单时，请注意下列型号命名方式，编写为车载型号。
主要规格
特性：
Grade
Automotive
Common Standard
AEC-Q101 (Automotive Grade)
Configuration
C-Common
Package Code
TO-263S (D2PAK)
Package(JEITA)
SC-83
Package Size[mm]
13.3x10.1 (t=4.5)
Mounting Style
Surface mount
Number of terminal
3
VRM[V]
150
Reverse Voltage VR[V]
150
Average Rectified Forward Current IO[A]
10.0
IFSM[A]
50.0
Forward Voltage VF(Max.)[V]
0.88
IF @ Forward Voltage [A]
5.0
Reverse Current IR(Max.)[mA]
0.015
VR @ Reverse Current[V]
150
Storage Temperature (Min.)[°C]
-40
Storage Temperature (Max.)[°C]
150
特点：
・ Cathode common dual type・ Low IR
・ High reliability
・ AEC-Q101 qualified
设计资源
技术记事
Schematic Design & Verification
- 开关波形的监测方法
- 功率测量中探针校正的重要性 倾斜校正篇
- 旁路电容器的阻抗特性
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- 热仿真用双热阻模型
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- 热阻RthJC 的测量方法和使用方法
- 使用热电偶测量封装背面温度时的注意点
设计模型
Models
- RB088NS150FH SPICE Model
- RB088NS150FH Thermal Model (lib)
Characteristics Data
- ESD Data
封装和质量数据
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations