Models
- DA228UFH SPICE Model
- DA228UFH Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMD3 STEP Data
Characteristics Data
- ESD Data
DA228UFH
DA228UFH
Switching Diodes (支持 AEC-Q101)
车载开关二极管
与通用品共用数据表。下订单时，请注意下列型号命名方式，编写为车载型号。
可以用于新设计，还可能会提供新的替代产品。
主要规格
特性：
Grade
Automotive
Common Standard
AEC-Q101 (Automotive Grade)
Configuration
Series Connection
Package Code
SOT-323
Package(JEITA)
SC-70
Package Size[mm]
2.0x2.1 (t=0.9)
Mounting Style
Surface mount
Number of terminal
3
VRM[V]
80
Reverse Voltage VR[V]
80
Average Rectified Forward Current IO[A]
0.1
IFM[A]
0.2
Isurge[mA]
300
Forward Voltage VF[V]
1.2
IF @ Forward Voltage [mA]
100.0
Reverse Current IR[µA]
0.01
VR @ Reverse Current [V]
80
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
特点：
・超小型塑胶型(UMD3)。・高可靠性。
设计资源
技术记事
Schematic Design & Verification
- 开关波形的监测方法
- 功率测量中探针校正的重要性 倾斜校正篇
- 旁路电容器的阻抗特性
Thermal Design
- 使用瞬态热阻抗计算结温的方法
- Notes for Temperature Measurement Using Thermocouples
- 热仿真用双热阻模型
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- 热阻RthJC 的测量方法和使用方法
- 使用热电偶测量封装背面温度时的注意点
设计模型
Models
- DA228UFH SPICE Model
- DA228UFH Thermal Model (lib)
- How to Create Symbols for PSpice Models
2D/3D/CAD
- UMD3 STEP Data
Characteristics Data
- ESD Data
封装和质量数据
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations