Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- YFZVFH20B Thermal Model (lib)
2D/3D/CAD
- TUMD2M STEP Data
Characteristics Data
- ESD Data
YFZVFH20B
主要规格
特性：
Grade
Automotive
Common Standard
AEC-Q101 (Automotive Grade)
Configuration
Single
Package Code
SOD-323HE
Package(JEITA)
SC-108B
Package Size[mm]
2.5x1.4 (t=0.6)
Mounting Style
Surface mount
Number of terminal
2
Power Dissipation (PD)[mW]
500
Zener Voltage VZ (Min.)[V]
18.63
Zener Voltage VZ (Max.)[V]
19.59
IZ @ VZ [mA]
10
Storage Temperature (Min.)[°C]
-55
Storage Temperature (Max.)[°C]
150
特点：
- Small power mold type (TUMD2M)
- High reliability
- Automatic mounting is possible by chip-mounter
设计资源
技术记事
Schematic Design & Verification
- 开关波形的监测方法
- 功率测量中探针校正的重要性 倾斜校正篇
- 旁路电容器的阻抗特性
Thermal Design
- Notes for Temperature Measurement Using Thermocouples
- 热仿真用双热阻模型
- Notes for Temperature Measurement Using Forward Voltage of PN Junction
- What is a Thermal Model? (Diode)
- 热阻RthJC 的测量方法和使用方法
- 使用热电偶测量封装背面温度时的注意点
设计模型
Simulations (Login Required)
- Method for Exporting Circuit Data (ROHM Solution Simulator)
Models
- YFZVFH20B Thermal Model (lib)
2D/3D/CAD
- TUMD2M STEP Data
Characteristics Data
- ESD Data
封装和质量数据
Package Information
- Package Dimensions
- Inner Structure
- Taping Information
- Explanation for Marking
- Moisture Sensitivity Level
- Anti-Whisker formation
- Condition of Soldering
Manufacturing Data
- Reliability Test Result
Environmental Data
- Constitution Materials List
- About Flammability of Materials
- About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
- Compliance of the RoHS / ELV directive
Export Information
- About Export Regulations