2SA1774
General Purpose Amplification Transistor

推荐罗姆标准规格产品2SAR523EB。

Data Sheet 购买
* 本产品是标准级的产品。
本产品不建议使用于车载设备。
Data Sheet 购买
  • 设计模型  
  • 封装和质量数据  
  • FAQ
  • 联系我们

主要规格

 
型号 | 2SA1774TL
Status | 可购买
封装 | EMT3
包装数量 | 3000
最小独立包装数量 | 3000
包装形态 | Taping
RoHS | Yes

特性：

Grade

Standard

Package Code

SOT-416

JEITA Package

SC-75A

Package Size[mm]

1.6x1.6 (t=0.7)

Number of terminal

3

Polarity

PNP

Collector Power dissipation PC[W]

0.15

Collector-Emitter voltage VCEO1[V]

-50.0

Collector current Io(Ic) [A]

-0.15

hFE

120 to 560

hFE (Min.)

120

hFE (Max.)

560

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点：

  • Excellent hFE linearity.
  • Complementary: 2SC4617
SHOW/HIDE COLUMNS
New Product List

设计资源

 

技术记事

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • 开关电路的功率损失计算
  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Models

  • 2SA1774 SPICE Model
  • 2SA1774 Thermal Model (lib)

2D/3D/CAD

  • EMT3 3D STEP Data

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations