2SAR523EB
General Purpose Amplification Transistor

根据市场需求,提供从超小型到功率型的封装,以节能高可靠性为开发理念的多种产品线。

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* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | 2SAR523EBTL
Status | 可购买
封装 | EMT3F
包装数量 | 3000
最小独立包装数量 | 3000
包装形态 | Taping
RoHS | Yes

特性:

Grade

Standard

Package Code

SOT-416FL

JEITA Package

SC-89

Package Size[mm]

1.6x1.6 (t=0.7)

Number of terminal

3

Polarity

PNP

Collector-Emitter voltage VCEO1[V]

-50.0

Collector current Io(Ic) [A]

-0.1

hFE

120 to 560

hFE (Min.)

120

hFE (Max.)

560

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点:

・一般増幅用表面安装型三极管

设计资源

 

技术记事

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • 开关电路的功率损失计算
  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Models

  • 2SAR523EB SPICE Model
  • 2SAR523EB Thermal Model (lib)

2D/3D/CAD

  • EMT3F STEP Data

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations