IMX25
Complex Transistor(BIP+BIP)

在超小型封装中内藏2个晶体管。适用于从差动增幅回路到高频水晶振动器，起动器等各种用途。

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主要规格

 
型号 | IMX25T110
Status | 可购买
封装 | SMT6
包装数量 | 3000
最小独立包装数量 | 3000
包装形态 | Taping
RoHS | Yes

特性：

Grade

Standard

Package Code

SOT-457

JEITA Package

SC-74

Package Size[mm]

2.9x2.8 (t=1.1)

Number of terminal

6

Polarity

NPN+NPN

Collector-Emitter voltage VCEO1[V]

20.0

Collector current Io(Ic) [A]

0.3

Collector-Emitter voltage VCEO2[V]

20.0

Collector current(continuous) IC2[A]

0.3

hFE

820 to 2700

hFE (Min.)

820

hFE (Max.)

2700

Mounting Style

Surface mount

Equivalent (Single Part)

2SD2704K / 2SD2704K

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点：

・增幅用超小型复合三极管
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设计资源

 

技术记事

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • 开关电路的功率损失计算
  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Models

  • IMX25 SPICE Model
  • IMX25 Thermal Model (lib)

2D/3D/CAD

  • SMT6 3D STEP Data

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations