DTA143XEFRA
Digital transistor(with built-in resistors) (支持 AEC-Q101)

车载数字晶体管

Data Sheet 购买
Data Sheet 购买
  • 设计模型  
  • 封装和质量数据  
  • FAQ
  • 联系我们

主要规格

 
型号 | DTA143XEFRATL
Status | 推荐品
封装 | EMT3
包装数量 | 3000
最小独立包装数量 | 3000
包装形态 | Taping
RoHS | Yes

特性：

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Package Code

SOT-416

JEITA Package

SC-75A

Package Size[mm]

1.6x1.6 (t=0.7)

Number of terminal

3

Polarity

PNP

Supply voltage VCC 1[V]

-50.0

Collector current Io (Ic) [A]

-0.1

Input resistance R1 1[kΩ]

4.7

Emitter base Resistance R2 1[kΩ]

10.0

Power Dissipation (PD)[W]

0.15

Mounting Style

Surface mount

GI hFE

30 to

Output Current [A]

0.1

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点：

・标准的数字晶体管
SHOW/HIDE COLUMNS
New Product List

设计资源

 

技术记事

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • 开关电路的功率损失计算
  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • 使用瞬态热阻抗计算结温的方法
  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Models

  • DTA143XEFRA SPICE Model
  • DTA143XEFRA Thermal Model (lib)
  • How to Create Symbols for PSpice Models

2D/3D/CAD

  • EMT3 3D STEP Data

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations