RFUH10NS6S
Fast Recovery Diodes

罗姆的快速恢复二极管具有超高速且低VF、有利于大幅提高开关电源効率,降低功率损失。

Data Sheet 购买 *
* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | RFUH10NS6STL
Status | 推荐品
封装 | TO-263S (D2PAK)
包装数量 | 1000
最小独立包装数量 | 1000
包装形态 | Taping
RoHS | Yes

特性:

Grade

Standard

Configuration

Single

Package Code

TO-263S (D2PAK)

Package(JEITA)

SC-83

Package Size[mm]

13.3x10.1 (t=4.5)

Mounting Style

Surface mount

Number of terminal

3

VRM[V]

600

Reverse Voltage VR[V]

600

Average Rectified Forward Current IO[A]

10.0

IFSM[A]

60.0

Forward Voltage VF(Max.)[V]

2.8

IF @ Forward Voltage [A]

10.0

Reverse Current IR(Max.)[mA]

0.01

VR @ Reverse Current [V]

600

trr(Max.)[ns]

25

IF @ trr [mA]

500

IR @ trr [A]

1.0

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点:

・功率塑胶型。
・超高速开关、高可靠性。

设计资源

 

技术记事

Schematic Design & Verification

  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • RFUH10NS6S SPICE Model
  • RFUH10NS6S Thermal Model (lib)

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations