RSX071VAM30
30V, 0.7A, 肖特基势垒二极管

RSX071VAM30是低VF、低 IR的一般整流用肖特基势垒二极管。

Data Sheet 购买 *
* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | RSX071VAM30TR
Status | 推荐品
封装 | TUMD2M
包装数量 | 3000
最小独立包装数量 | 3000
包装形态 | Taping
RoHS | Yes

特性:

Grade

Standard

Configuration

Single

Package Code

SOD-323HE

Package(JEITA)

SC-108B

Package Size[mm]

2.5x1.4 (t=0.6)

Mounting Style

Surface mount

Number of terminal

2

VRM[V]

30

Reverse Voltage VR[V]

30

Average Rectified Forward Current IO[A]

0.7

IFSM[A]

5.0

Forward Voltage VF(Max.)[V]

0.42

IF @ Forward Voltage [A]

0.7

Reverse Current IR(Max.)[mA]

0.2

VR @ Reverse Current[V]

30

Storage Temperature (Min.)[°C]

-40

Storage Temperature (Max.)[°C]

150

特点:

  • Small mold type (TUMD2M)
  • High reliability
  • Low VF and low IR

设计资源

 

技术记事

Schematic Design & Verification

  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • RSX071VAM30 SPICE Model

2D/3D/CAD

  • TUMD2M STEP Data

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations