BD16939AEFV-C
车载用内置SPI 6ch半桥驱动器

BD16939AEFV-C是面向车载应用设计的6ch半桥驱动器。可直接驱动小型DC有刷电机,能够以High输出、Low输出、Hi-Z输出等3种模式独立控制各输出。通过16bit 串行接口(SPI)可从外部MCU进行控制。实现了高耐压(最大额定40V)、低ON电阻、小型封装,可有助于实现整机的高可靠性、低功耗、低成本化。

主要规格

 
型号 | BD16939AEFV-CE2
Status | 推荐品
封装 | HTSSOP-B28
包装数量 | 2500
最小独立包装数量 | 2500
包装形态 | Taping
RoHS | Yes
Functional Safety | FS supportive

特性:

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

Vcc (Max.)[V]

40.0

Power Supply Voltage (Max.)[V]

32.0

Power Supply Voltage (Min.)[V]

6.3

Iout (Max.)[A]

1.0

Output On Resistance (Typ.)[Ω]

1.35

Number of Motors

3.0

VREF・PWM

-

Current Limit

Yes

High Speed Drive

-

Automotive class

Yes

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

特点:

  • AEC-Q100 Qualified (Grade 1)
  • 1.0A DMOS Half Bridge 6 Circuits
  • Three Mode Output Control (High, Low & High Impedance)
  • Low Standby Current
  • Built-in Protection Diode Against Output Reverse Voltage
  • Over Current Protection at VS Supply Stage (OCP)
  • Under Load Detection at VS Supply Stage (ULD)
  • Over Voltage Protection with OVDSEL Mode at VS Supply Stage (OVP)
  • Under Voltage Lock Out at VS Supply Stage (UVLO)
  • Thermal Shutdown (TSD), Thermal Warning (TW)

设计资源

 

技术记事

Schematic Design & Verification

  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻、热特性参数
  • 使用热电偶测量封装背面温度时的注意点

设计模型

2D/3D/CAD

  • HTSSOP-B28 Footprint / Symbol
  • HTSSOP-B28 3D STEP Data

封装和质量数据

Manufacturing Data

  • Factory Information