BD16950EFV-C
2ch 半桥栅极驱动器

BD16950EFV是符合AEC-Q100的2ch半桥栅极驱动器。可通过从外部MCU执行16位串行外设接口(SPI)进行控制。可独立控制高边/低边Nch-MOSFET,可通过MCU以各种模式进行控制。而且,用于调整转换速率的可变驱动电流设定适用于EMI和高效率驱动。错误信号可通过MCU读取。还可通过MCU复位各种设定寄存器。

主要规格

 
型号 | BD16950EFV-CE2
Status | 推荐品
封装 | HTSSOP-B24
包装数量 | 2000
最小独立包装数量 | 2000
包装形态 | Taping
RoHS | Yes
Functional Safety | FS supportive

特性:

Grade

Automotive

Common Standard

AEC-Q100 (Automotive Grade)

Vcc (Max.)[V]

40.0

Power Supply Voltage (Max.)[V]

40.0

Power Supply Voltage (Min.)[V]

5.5

Output On Resistance (Typ.)[Ω]

10.0

Number of Motors

1.0

VREF・PWM

-

Current Limit

-

High Speed Drive

-

Automotive class

Yes

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

特点:

  • AEC-Q100 Qualified
  • 2ch Half-Bridge Gate Drivers
  • 4 external MOSFETs are Controlled Independently
  • Half-Bridge Control Modes are Selected by SPI
  • Slew Rates are Controlled with Constant Source/Sink Current.
  • 500 kHz Oscillation for Charge Pump.
  • 16bit SPI

设计资源

 

文档

User's Guide

  • Evaluation Board User's Guide for BD16950EFV-C

Application Note

  • 2 Channel Half-Bridge Gate Driver Setup Guide

技术记事

Schematic Design & Verification

  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻、热特性参数
  • 使用热电偶测量封装背面温度时的注意点

设计模型

2D/3D/CAD

  • HTSSOP-B24 Footprint / Symbol
  • HTSSOP-B24 3D STEP Data

封装和质量数据

Manufacturing Data

  • Factory Information

Environmental Data

  • REACH SVHC Non-use Declaration