ROHM Product Detail

最终销售 BSM400C12P3G202
SiC(碳化硅)功率模块

指正在申请中止制造的产品。

主要规格

 
型号 | BSM400C12P3G202
Status | 最终销售
封装 | G Type
包装形态 | Corrugated Cardboard
包装数量 | 4
最小独立包装数量 | 4
RoHS | Yes

特性:

Drain-source Voltage[V]

1200

Drain Current[A]

358

Total Power Dissipation[W]

1570

Junction Temperature (Max.) [℃]

175

Storage Temperature (Min.) [℃]

-40

Storage Temperature (Max.) [℃]

125

Package

Chopper

Package Size [mm]

152.0x62.0 (t=18.0)

特点:

  • Low surge, low switching loss.
  • High-speed switching possible.
  • Reduced temperature dependance.

参考设计 / 应用评估套件

 
    • Drive Board - BSMGD3G12D24-EVK001
    • This evaluation board, BSMGD3G12D24-EVK001, is a gate driver board for full SiC Modules with the 3rd / 4th Generation SiC-MOSFET in G and E type housing. This evaluation board contains all the necessary components for optimal and safety driving the SiC module.

  • User's Guide
    • Snubber Module - MGSM1D72J2-145MH16
    • Snubber Module for BSM series (1200V, E / G type)

    • Drive Board - TAMURA 2DU series
    • Drive Board for BSM series (1200V, C / E / G type)

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