RFN1L7SDD
Fast Recovery Diodes (支持 AEC-Q101)

车载快速恢复二极管
与通用品共用数据表。下订单时,请注意下列型号命名方式,编写为车载型号。

主要规格

 
型号 | RFN1L7SDDTE25
Status | 推荐品
封装 | PMDS
包装数量 | 1500
最小独立包装数量 | 1500
包装形态 | Taping
RoHS | Yes

特性:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Configuration

Single

Package Code

DO-214AC (SMA)

Package Size[mm]

5.0x2.6 (t=2.0)

Mounting Style

Surface mount

Number of terminal

2

VRM[V]

700

Reverse Voltage VR[V]

700

Average Rectified Forward Current IO[A]

0.8

IFSM[A]

15.0

Forward Voltage VF(Max.)[V]

1.5

IF @ Forward Voltage [A]

0.8

Reverse Current IR(Max.)[mA]

0.001

VR @ Reverse Current [V]

700

trr(Max.)[ns]

80

IF @ trr [mA]

500

IR @ trr [A]

1.0

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点:

・小型功率塑胶型(PMDS)。
・低VF、高速开关、低开关损失品。

设计资源

 

技术记事

Schematic Design & Verification

  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Models

  • RFN1L7SDD Thermal Model (lib)

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations