RB501SM-30FH
30V, 0.1A, 肖特基势垒二极管(支持AEC-Q101)

RB501SM-30FH是支持车载的高可靠性肖特基势垒二极管。

主要规格

 
型号 | RB501SM-30FHT2R
Status | 可购买
封装 | EMD2
包装数量 | 8000
最小独立包装数量 | 8000
包装形态 | Taping
RoHS | Yes

特性:

Grade

Automotive

Common Standard

AEC-Q101 (Automotive Grade)

Configuration

Single

Package Code

SOD-523

Package(JEITA)

SC-79

Package Size[mm]

1.6x0.8 (t=0.6)

Mounting Style

Surface mount

Number of terminal

2

VRM[V]

30

Reverse Voltage VR[V]

30

Average Rectified Forward Current IO[A]

0.1

IFSM[A]

1.0

Forward Voltage VF(Max.)[V]

0.35

IF @ Forward Voltage [A]

0.01

Reverse Current IR(Max.)[mA]

0.01

VR @ Reverse Current[V]

10

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

125

特点:

・超小型塑胶型(EMD2)。
・低VF型、高可靠性

设计资源

 

技术记事

Schematic Design & Verification

  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • What is a Thermal Model? (Diode)
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • RB501SM-30FH SPICE Model
  • RB501SM-30FH Thermal Model (lib)

2D/3D/CAD

  • EMD2 STEP Data

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations