BR25H080FJ-2C
车载用 125℃工作 SPI BUS 8kbit (1024x8bit) EEPROM

BR25H080-2C是SPI BUS接口方式的串行EEPROM。

主要规格

 
型号 | BR25H080FJ-2CE2
Status | 推荐品
封装 | SOP-J8
包装数量 | 2500
最小独立包装数量 | 2500
包装形态 | Taping
RoHS | Yes

功能安全:

类别 : FS supportive
A product that has been developed for automotive use and is capable of supporting safety analysis with regard to the functional safety.

特性:

Series

BR25H-2C

Grade

Automotive

I/F

SPI BUS

Density [bit]

8k

Bit Format [Word x Bit]

1k x 8

Package

SOP-J8

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

125

Vcc(Min.)[V]

2.5

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

3.0

Standby Current (Max.)[μA]

10.0

Write Cycle (Max.)[ms]

4.0

Input Frequency (Max.)[Hz]

10M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

100

特点:

・High speed clock action up to 10MHz (Max.)
・Wait function by HOLDB terminal.
・Part or whole of memory arrays settable as read only
memory area by program.
・2.5V to 5.5V single power source action most
suitable
for battery use.
・Page write mode useful for initial value write at
factory shipment.
・For SPI bus interface (CPOL, CPHA)=(0, 0), (1, 1)
・Self-timed programming cycle.
・Low Supply Current
At write operation (5V) : 1.0A (Typ.)
At read operation (5V) : 1.0mA (Typ.)
At standby operation (5V) : 0.1μA (Typ.)
・Address auto increment function at read operation
・Prevention of time mistake
Write prohibition at power on.
Write prohibition by command code (WRDI).
Write prohibition by WPB pin.
Write prohibition block setting by status registers
(BP1, BP0).
Prevention of write mistake at low voltage.
・MSOP8, TSSOP-B8, SOP8, SOP-J8 Package
・Data at shipment Memory array: FFh, status register
WPEN, BP1, BP0 : 0
・More than 100 years data retention.
・More than 1 million write cycles.
・AEC-Q100 Qualified.

设计资源

 

文档

Application Note

  • Difference between BR25H-2C, BR25H-W(C) and BR35H-WC

技术记事

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • 旁路电容器的阻抗特性

Thermal Design

  • 使用瞬态热阻抗计算结温的方法
  • 热阻、热特性参数

设计模型

2D/3D/CAD

  • SOP-J8 Footprint / Symbol
  • SOP-J8 3D STEP Data

封装和质量数据

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)