BR25G512FJ-3
SPI BUS EEPROM

BR25G512-3FJ是512kbit SPI BUS 接口的串行EEPROM。

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* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | BR25G512FJ-3GE2
Status | 推荐品
封装 | SOP-J8
包装数量 | 2500
最小独立包装数量 | 2500
包装形态 | Taping
RoHS | Yes

特性:

Series

BR25G-3

Grade

Standard

I/F

SPI BUS

Density [bit]

512k

Bit Format [Word x Bit]

64k x 8

Package

SOP-J8

Operating Temperature (Min.)[°C]

-40

Operating Temperature (Max.)[°C]

85

Vcc(Min.)[V]

1.8

Vcc(Max.)[V]

5.5

Circuit Current (Max.)[mA]

4.0

Standby Current (Max.)[μA]

1.0

Write Cycle (Max.)[ms]

5.0

Input Frequency (Max.)[Hz]

10M

Endurance (Max.)[Cycle]

106

Data Retention (Max.)[Year]

100

特点:

  • High Speed Clock Action up to 10MHz (Max)
  • Wait Function by HOLDB Terminal
  • Part or Whole of Memory Arrays Settable as Read only Memory Area by Program
  • 1.8V to 5.5V Single Power Source Operation Most Suitable for Battery Use
  • Up to 128 Bytes in Page Write Mode.
  • For SPI BUS interface (CPOL, CPHA) = (0, 0), (1, 1)
  • Self-timed Programming Cycle
  • Low Current Consumption
    ·At Write Action (5V) : 0.7mA (Typ)
    ·At Read Action (5V) : 2.4mA (Typ)
    ·At Standby Action (5V) : 0.1µA (Typ)
  • Address Auto Increment Function at Read Action
  • Prevention of Write Mistake
    ·Write Prohibition at Power On
    ·Write Prohibition by Command Code (WRDI)
    ·Write Prohibition by WPB Pin
    ·Write Prohibition Block Setting by Status Registers (BP1, BP0)
    ·Prevention of Write Mistake at Low Voltage
  • More than 100 years Data Retention
  • More than 1 Million Write Cycles
  • Bit Format 64K×8
  • Initial Delivery Data
    Memory Array: FFh
    Status Register: WPEN, BP1, BP0 : 0

设计资源

 

技术记事

Schematic Design & Verification

  • Opcode, Address, and Page Configuration for SPI BUS EEPROM
  • 旁路电容器的阻抗特性

Thermal Design

  • 热阻、热特性参数

设计模型

2D/3D/CAD

  • SOP-J8 Footprint / Symbol
  • SOP-J8 3D STEP Data

封装和质量数据

Package Information

  • Package Information
  • Anti-Whisker formation

Manufacturing Data

  • Factory Information

Environmental Data

  • UL94 Flame Classifications of Mold Compound
  • Compliance with the ELV directive
  • REACH SVHC Non-use Declaration
  • RoHS Comission Delegated Directive

Export Information

  • The Export Control Order
  • Export Administration Regulations(EAR)