QH8MA3
30V Nch+Pch 中功率MOSFET

QH8MA3是低导通电阻的中功率MOSFET。采用小型表面安装封装,有助于节省空间。

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* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | QH8MA3TCR
Status | 推荐品
封装 | TSMT8
包装数量 | 3000
最小独立包装数量 | 3000
包装形态 | Taping
RoHS | Yes

特性:

Grade

Standard

Package Code

TSMT8

Package Size[mm]

3.0x2.8 (t=0.8)

Applications

Motor

Number of terminal

8

Polarity

Nch+Pch

Drain-Source Voltage VDSS[V]

30

Drain Current ID[A]

7.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.035

RDS(on)[Ω] VGS=10V(Typ.)

0.022

RDS(on)[Ω] VGS=Drive (Typ.)

0.035

Total gate charge Qg[nC]

3.7

Power Dissipation (PD)[W]

2.5

Drive Voltage[V]

4.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点:

· Low on - resistance.
· Small Surface Mount Package (TSMT8).
· Pb-free lead plating; RoHS compliant.
· Halogen Free

设计资源

 

技术记事

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • 开关电路的功率损失计算
  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Models

  • QH8MA3 SPICE Model

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations