RV3C002UN
RASMID™系列, Nch 20V 150mA 小信号MOSFET

超小型封装(0604尺寸)的RV3C002UN适用于便携式设备用途。

Data Sheet 购买 *
* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | RV3C002UNT2CL
Status | 推荐品
封装 | VML0604
包装数量 | 8000
最小独立包装数量 | 8000
包装形态 | Taping
RoHS | Yes

特性:

Grade

Standard

Package Code

DFN0604-3

Package Size[mm]

0.6x0.4 (t=0.36)

Number of terminal

3

Polarity

Nch

Drain-Source Voltage VDSS[V]

20

Drain Current ID[A]

0.15

RDS(on)[Ω] VGS=1.5V(Typ.)

2.7

RDS(on)[Ω] VGS=2.5V(Typ.)

1.7

RDS(on)[Ω] VGS=4.5V(Typ.)

1.4

RDS(on)[Ω] VGS=Drive (Typ.)

2.7

Power Dissipation (PD)[W]

0.1

Drive Voltage[V]

1.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点:

· Ultra Small Package (0.6x0.4x0.36mm)
· Low voltage drive makes this device ideal for portable equipment.
· Drive circuits can be simple.
·Built-in ESD Protection Diode.

设计资源

 

技术记事

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • 开关电路的功率损失计算
  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Models

  • RV3C002UN SPICE Model

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations