RF4G060AT (新产品)
Pch -40V -6A Power, DFN2020, MOSFET

RF4G060AT是适合开关和负载开关应用的DFN封装MOSFET。

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* 本产品是标准级的产品。
本产品不建议使用于车载设备。
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主要规格

 
型号 | RF4G060ATTCR
Status | 推荐品
封装 | HUML2020L8 (Single)
包装数量 | 3000
最小独立包装数量 | 3000
包装形态 | Taping
RoHS | Yes

特性：

Grade

Standard

Package Code

DFN2020-8S

Package Size[mm]

2.0x2.0 (t=0.6)

Number of terminal

8

Polarity

Pch

Drain-Source Voltage VDSS[V]

-40

Drain Current ID[A]

-6.0

RDS(on)[Ω] VGS=4.5V(Typ.)

0.04

RDS(on)[Ω] VGS=10V(Typ.)

0.032

RDS(on)[Ω] VGS=Drive (Typ.)

0.04

Total gate charge Qg[nC]

8.5

Power Dissipation (PD)[W]

2.0

Drive Voltage[V]

-4.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点：

  • Low on - resistance
  • High power small mold package (HUML2020L8)
  • Pb-free plating ; RoHS compliant
  • Halogen Free
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设计资源

 

技术记事

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • 开关电路的功率损失计算
  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • 使用瞬态热阻抗计算结温的方法
  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

封装和质量数据

Package Information

  • Package Dimensions
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Environmental Data

  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations