RQ5E035AT
Pch -30V -3.5A 功率MOSFET

RQ5E035AT是适用于开关用途的小型表面安装封装的功率MOSFET。

Data Sheet 购买 *
* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | RQ5E035ATTCL
Status | 推荐品
封装 | TSMT3
包装数量 | 3000
最小独立包装数量 | 3000
包装形态 | Taping
RoHS | Yes

特性:

Grade

Standard

Package Code

SOT-346T

JEITA Package

SC-96

Package Size[mm]

2.9x2.8 (t=1.0)

Applications

Switching

Number of terminal

3

Polarity

Pch

Drain-Source Voltage VDSS[V]

-30

Drain Current ID[A]

-3.5

RDS(on)[Ω] VGS=4.5V(Typ.)

0.054

RDS(on)[Ω] VGS=10V(Typ.)

0.038

RDS(on)[Ω] VGS=Drive (Typ.)

0.054

Total gate charge Qg[nC]

5.2

Power Dissipation (PD)[W]

1.0

Drive Voltage[V]

-4.5

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点:

· Low on -resistance.
· Small Surface Mount Package(TSMT3).
· Pb-free lead plating; RoHS compliant

设计资源

 

技术记事

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • 开关电路的功率损失计算
  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Models

  • RQ5E035AT SPICE Model
  • RQ5E035AT Thermal Model (lib)

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations