BD63731EFV
(新产品)

BD63731EFV (新产品)
高性能、高可靠性, 36V耐压 步进电机驱动器

BD63731EFV是额定电源36V、额定输出电流3.0A的低功耗双极PWM恒流驱动器。输入接口采用CLK-IN驱动方式,通过内置DAC,励磁模式可适用FULL STEP(2种)、HALF STEP(2种)、QUARTER STEP(2种)、1/8STEP、1/16STEP模式。电流衰减方式方面可任意设定SLOW/FAST DECAY的比率,可对各种电机实现优良控制状态。另外,也可使用一个系统电源进行驱动,有助于提高整机设计的便利性。

Data Sheet 购买 *
* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | BD63731EFV-E2
Status | 推荐品
封装 | HTSSOP-B28
包装数量 | 2500
最小独立包装数量 | 2500
包装形态 | Taping
RoHS | Yes

特性:

Grade

Standard

Vcc (Max.)[V]

36.0

Power Supply Voltage (Max.)[V]

28.0

Power Supply Voltage (Min.)[V]

8.0

Iout (Max.)[A]

3.0

Iout Peak (Max.)[A]

3.5

Output On Resistance (Typ.)[Ω]

0.28

Interface

CLK-IN

Step

to 1 / 16

MIX DECAY Function

Yes

Single power supply input

Yes

Automotive class

No

Operating Temperature (Min.)[°C]

-25

Operating Temperature (Max.)[°C]

80

特点:

  • Rated Output Current 3.0 A
  • Low ON Resistance DMOS Output
  • CLK-IN Drive Mode
  • PWM Constant Current (other oscillation)
  • Built-in Spike Noise Cancel Function (external noise filter is unnecessary)
  • FULL STEP (2 types), HALF STEP (2 types), QUARTER STEP (2 types), 1/8 STEP, 1/16 STEP Functionality
  • Freely Timing Excitation Mode Switch
  • Current Decay Mode Switch (linearly variable SLOW/FAST DECAY ratio)
  • Normal Rotation & Reverse Rotation Switching Function
  • Power Save Function
  • Built-in Logic Input Pull-down Resistor
  • Power-on Reset Function
  • Thermal Shutdown Circuit (TSD)
  • Over-current Protection Circuit (OCP)
  • Under Voltage Lock Out Circuit (UVLO)
  • Over Voltage Lock Out Circuit (OVLO)
  • Protects Against Malfunction when Power Supply is Disconnected (Ghost Supply Prevention Function)
  • Adjacent Pins Short Protection
  • Microminiature, Ultra-thin and High Heat-radiation (exposed metal type) Package

设计资源

 

技术记事

Schematic Design & Verification

  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻、热特性参数
  • 使用热电偶测量封装背面温度时的注意点

设计模型

2D/3D/CAD

  • HTSSOP-B28 Footprint / Symbol
  • HTSSOP-B28 3D STEP Data

封装和质量数据

Manufacturing Data

  • Factory Information