2SC5824
High speed switching Transistor

根据市场需求,提供从超小型到功率型的封装,以节能高可靠性为开发理念的多种产品线。

可以用于新设计,还可能会提供新的替代产品
Data Sheet 购买
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Data Sheet 购买

主要规格

 
型号 | 2SC5824T100
Status | 可购买
封装 | MPT3
包装数量 | 1000
最小独立包装数量 | 1000
包装形态 | Taping
RoHS | Yes

特性:

Grade

Standard

Package Code

SOT-89

JEITA Package

SC-62

Package Size[mm]

4.5x4.0 (t=1.5)

Number of terminal

3

Polarity

NPN

Collector Power dissipation PC[W]

0.5

Collector-Emitter voltage VCEO1[V]

60.0

Collector current Io(Ic) [A]

3.0

hFE

120 to 270

hFE (Min.)

120

hFE (Max.)

270

Mounting Style

Surface mount

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点:

・高速开关用三极管表面安装型

设计资源

 

技术记事

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • 开关电路的功率损失计算
  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • 2SC5824 SPICE Model
  • 2SC5824 Thermal Model (lib)

Characteristics Data

  • 2SC5824 Thermal Resistance

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Moisture Sensitivity Level
  • Anti-Whisker formation
  • Condition of Soldering

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List - Please contact us by filling in the form.
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations