RS3E095BN
Nch 30V 9.5A 中功率MOSFET

RS3E095BN是小型表面贴装封装的低导通电阻MOSFET,适合开关用途。

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* 本产品是标准级的产品。
本产品不建议使用于车载设备。

主要规格

 
型号 | RS3E095BNGZETB
Status | 推荐品
封装 | SOP8
包装数量 | 2500
最小独立包装数量 | 2500
包装形态 | Taping
RoHS | Yes

特性:

Grade

Standard

Package Code

SOP8

Package Size[mm]

5.0x6.0 (t=1.75)

Applications

Switching, Motor

Number of terminal

8

Polarity

Nch

Drain-Source Voltage VDSS[V]

30

Drain Current ID[A]

9.5

RDS(on)[Ω] VGS=4.5V(Typ.)

0.0175

RDS(on)[Ω] VGS=10V(Typ.)

0.0119

RDS(on)[Ω] VGS=Drive (Typ.)

0.0175

Total gate charge Qg[nC]

8.3

Power Dissipation (PD)[W]

2.0

Drive Voltage[V]

4.5

Mounting Style

Surface mount

Bare Die Part Number

Available: K4001

Storage Temperature (Min.)[°C]

-55

Storage Temperature (Max.)[°C]

150

特点:

  • Low on - resistance.
  • Small Surface Mount Package (SOP8)
  • Pb-free lead plating; RoHS compliant

设计资源

 

技术记事

Schematic Design & Verification

  • Temperature derating method for Safe Operating Area (SOA)
  • 开关电路的功率损失计算
  • 开关波形的监测方法
  • 功率测量中探针校正的重要性 倾斜校正篇
  • 旁路电容器的阻抗特性

Thermal Design

  • Notes for Temperature Measurement Using Thermocouples
  • 热仿真用双热阻模型
  • What is a Thermal Model? (Transistor)
  • Notes for Temperature Measurement Using Forward Voltage of PN Junction
  • 热阻RthJC 的测量方法和使用方法
  • 使用热电偶测量封装背面温度时的注意点

设计模型

Simulations (Login Required)

  • Method for Exporting Circuit Data (ROHM Solution Simulator)

Models

  • RS3E095BN SPICE Model

Characteristics Data

  • ESD Data

封装和质量数据

Package Information

  • Package Dimensions
  • Inner Structure
  • Taping Information
  • Explanation for Marking
  • Condition of Soldering
  • Moisture Sensitivity Level
  • Anti-Whisker formation

Manufacturing Data

  • Reliability Test Result

Environmental Data

  • Constitution Materials List
  • About Flammability of Materials
  • About Non-use SVHC under Reach Regulation : Please contact us by filling in the form.
  • Compliance of the RoHS / ELV directive

Export Information

  • About Export Regulations